TPS65270_15 Datasheet, PDF (6/27 Pages) Texas Instruments – 4.5-V TO 18-V INPUT VOLTAGE, 2-A/3-A OUTPUT CURRENT, DUAL SYNCHRONOUS STEP-DOWN REGULATOR WITH INTEGRATED MOSFET

TPS65270
SLVSAX7D – AUGUST 2011 – REVISED APRIL 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Voltage range at VIN1, VIN2, LX1, LX2
–0.3 to 18
V
Voltage range at LX1, LX2 (maximum withstand voltage transient < 10 ns)
–1 to 18
V
Voltage at BST1, BST2, referenced to LX1, LX2 pin
–0.3 to 7
V
Voltage at VCC, EN1, EN2, COMP1, COMP2, LOW_P
–0.3 to 7
V
Voltage at SS1, SS2, FB1, FB2, ROSC
–0.3 to 3.6
V
Voltage at AGND, GND
–0.3 to 0.3
V
T_J
T_STG
Operating virtual junction temperature range
Storage temperature range
–40 to 125
°C
–55 to 150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
VIN
Input operating voltage
T_A
Ambient temperature
MIN NOM MAX UNIT
4.5
18
V
–40
85
°C
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
Human body model (HBM)
Charge device model (CDM)
MIN
2000
500
MAX
UNIT
V
V
PACKAGE DISSIPATION RATINGS^(1)(2)(3)
PACKAGE
θ_JA (°C/W)
θ_JC (°C/W)
T_A = 25°C
POWER RATING (W)
PWP
32.6
10
3.07
RGE
32.6
10
3.07
T_A = 55°C
POWER RATING (W)
2.15
2.15
T_A = 85°C
POWER RATING (W)
1.23
1.23
(1) This assumes a JEDEC JESD 51-5 standard board with thermal vias with High K profile - See Texas Instruments application report
(SLMA002) regarding thermal characteristics of the PowerPAD™ package.
(2) This assumes junction to exposed PAD.
(3) Based on JEDEC 51.5 HIGH K environment measured on a 76.2 x 114 x .6-mm board with the following layer arrangement:
(a) Top layer: 2 Oz Cu, 6.7% coverage
(b) Layer 2: 1 Oz Cu, 90% coverage
(c) Layer 3: 1 Oz Cu, 90% coverage
(d) Bottom layer: 2 Oz Cu, 20% coverage
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