TPA3251D2_15 Datasheet, PDF (6/39 Pages) Texas Instruments – TPA3251D2 175-W Stereo, 350-W Mono PurePath™ Ultra-HD Analog-Input Class-D Amplifier

TPA3251D2
SLASE40C – JUNE 2015 – REVISED JUNE 2015
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PVDD_x
GVDD_x
VDD
R_L(BTL)
R_L(SE)
R_L(PBTL)
L_OUT(BTL)
L_OUT(SE)
L_OUT(PBTL)
F_PWM
R_{(FREQ_ADJ)}
C_PVDD
R_OC
R_OC(LATCHED)
V_{(FREQ_ADJ)}
T_J
Half-bridge supply
Supply for logic regulators and gate-drive
circuitry
Digital regulator supply voltage
Load impedance
Output filter inductance
PWM frame rate selectable for AM
interference avoidance; 1% Resistor
tolerance
PWM frame rate programming resistor
PVDD close decoupling capacitors
Over-current programming resistor
Over-current programming resistor
Voltage on FREQ_ADJ pin for slave
mode operation
Junction temperature
DC supply voltage
DC supply voltage
DC supply voltage
Output filter inductance within
recommended value range
Minimum output inductance at I_OC
Nominal
AM1
AM2
Nominal; Master mode
AM1; Master mode
AM2; Master mode
Resistor tolerance = 5%
Resistor tolerance = 5%
Slave mode
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MIN TYP
12 36
10.8 12
10.8 12
2.7 4
1.5 3
1.6 2
5
5
5
575 600
475 500
430 450
9.9 10
19.8 20
29.7 30
1.0
22
47
3.3
0
MAX
38
13.2
13.2
625
525
470
10.1
20.2
30.3
30
64
125
UNIT
V
V
V
Ω
μH
kHz
kΩ
μF
kΩ
kΩ
V
°C
7.4 Thermal Information
TPA3251D2
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
DDV 44-PINS HTSSOP
JEDEC STANDARD
4 LAYER PCB
50.7
FIXED 85°C
HEATSINK
TEMPERATURE ⁽²⁾
2.5 ⁽²⁾
0.36
0.2
24.4
n/a
0.19
0.5
24.2
n/a
n/a
n/a
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Thermal data are obtained with 85°C heat sink temperature using thermal compound with 0.7W/mK thermal conductivity and 2mil
thickness. In this model heat sink temperature is considered to be the ambient temperature and only path for dissipation is to the
heatsink.
6
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