SN74CBTD3861_06 Datasheet, PDF (6/13 Pages) Texas Instruments – 10-BIT FET BUS SWITCH WITH LEVEL SHIFTING

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PACKAGE OPTION ADDENDUM
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
74CBTD3861DBQRE4
74CBTD3861DBQRG4
74CBTD3861DGVRE4
SN74CBTD3861DBQR
SN74CBTD3861DBR
SN74CBTD3861DBRE4
SN74CBTD3861DGVR
SN74CBTD3861DW
SN74CBTD3861DWE4
SN74CBTD3861DWR
SN74CBTD3861DWRE4
SN74CBTD3861PW
SN74CBTD3861PWE4
SN74CBTD3861PWR
SN74CBTD3861PWRE4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP/
QSOP
SSOP/
QSOP
TVSOP
Package
Drawing
DBQ
DBQ
DGV
SSOP/
QSOP
SSOP
DBQ
DB
SSOP
DB
TVSOP
DGV
SOIC
DW
SOIC
DW
SOIC
DW
SOIC
DW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Addendum-Page 1