CD54HC283 Datasheet, PDF (6/11 Pages) Texas Instruments – High-Speed CMOS Logic 4-Bit Binary Full Adder with Fast Carry

www.ti.com
PACKAGE OPTION ADDENDUM
1-Jul-2005
PACKAGING INFORMATION
Orderable Device
5962-8976501EA
CD54HC283F3A
CD54HCT283F3A
CD74HC283E
CD74HC283M
CD74HC283M96
CD74HC283M96E4
CD74HC283ME4
CD74HC283MT
CD74HC283MTE4
CD74HCT283E
CD74HCT283EE4
CD74HCT283M
CD74HCT283M96
CD74HCT283M96E4
CD74HCT283ME4
CD74HCT283MT
CD74HCT283MTE4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CDIP
CDIP
CDIP
PDIP
Package
Drawing
J
J
J
N
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
PDIP
N
PDIP
N
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16
1
TBD
Call TI
Level-NC-NC-NC
16
1
TBD
Call TI
Level-NC-NC-NC
16
1
TBD
Call TI
Level-NC-NC-NC
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
Addendum-Page 1