TPS61310YFFR Datasheet, PDF (52/57 Pages) Texas Instruments – 1.5A Multiple LED Camera Flash and Video Light Driver With I2CTM Compatible Interface

TPS61310, TPS61311
SLVS978C – MARCH 2010 – REVISED NOVEMBER 2012
PACKAGE SUMMARY
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CHIP SCALE PACKAGE
(BOTTOM VIEW)
A4
A3
A2
A1
CHIP SCALE PACKAGE
(TOP VIEW)
B4
B3
B2
B1
D
C4
C3
C2
C1
ABC
D4
D3
D2
D1
A1
E4
E3
E2
E1
E
Note: "ABC" is a place holder for the actual
package marking. (See Table 1)
CHIP SCALE PACKAGE DIMENSIONS
The TPS6131x device is available in a 20-bump chip scale package (YFF, NanoFree™). The package
dimensions are given as:
• D = 2170 ±30 μm
• E = 1928 ±30 μm
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