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TPS28226 Datasheet, PDF (5/35 Pages) Texas Instruments – High-Frequency 4-A Sink Synchronous MOSFET Drivers
TPS28226
www.ti.com
SLUS791 – OCTOBER 2007
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)(2)
TPS28226
Input supply voltage range, VDD(3)
Boot voltage, VBOOT
Phase voltage, VPHASE
DC
Pulse < 400 ns, E = 20 μJ
Input voltage range, VPWM, VEN/PG
Output voltage range, VUGATE Pulse < 100 ns, E = 2 μJ
Output voltage range, VLGATE Pulse < 100 ns, E = 2 μJ
ESD rating, HBM
ESD rating, HBM ESD rating, CDM
Continuous total power dissipation
Operating virtual junction temperature range, TJ
Operating ambient temperature range, TA
Storage temperature, Tstg
Lead temperature (soldering, 10 sec.)
VALUE
–0.3 to 8.8
–0.3 to 33
–2 to 32 or VBOOT + 0.3 – VDD whichever is less
–7 to 33.1 or VBOOT + 0.3 – VDD whichever is less
–0.3 to 13.2
VPHASE – 0.3 to VBOOT + 0.3, (VBOOT – VPHASE < 8.8)
VPHASE – 2 to VBOOT + 0.3, (VBOOT – VPHASE < 8.8)
–0.3 to VDD + 0.3
–2 to VDD + 0.3
2k
500
See Dissipation Rating Table
–40 to 150
–40 to 125
–65 to 150
300
UNIT
V
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) These devices are sensitive to electrostatic discharge; follow proper device handling procedures.
(3) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. Consult
Packaging Section of the Data book for thermal limitations and considerations of packages.
DISSIPATION RATINGS(1)
BOARD
High-K (2)
High-K (3)
PACKAGE
D
DRB
RθJC
39.4°C/W
1.4°C/W
RθJA
100C/W
48.5C/W
DERATING FACTOR
ABOVE TA = 25°C
10 mW/C
20.6 mW/C
TA < 25°C
POWER RATING
1.25 W
2.58 W
TA =70°C
POWER RATING
0.8 W
1.65 W
TA = 85°C
POWER RATING
0.65 W
1.34 W
(1) These thermal data are taken at standard JEDEC test conditions and are useful for the thermal performance comparison of different
packages. The cooling condition and thermal impedance RθJA of practical design is specific.
(2) The JEDEC test board JESD51-7, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and 2-oz top and bottom trace
layers.
(3) The JEDEC test board JESD51-5 with direct thermal pad attach, 3-inch x 3-inch, 4-layer with 1-oz internal power and ground planes and
2-oz top and bottom trace layers.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
VDD Input supply voltage
VIN Power input voltage
TJ Operating junction temperature range
MIN
TYP
MAX UNIT
6.8
7.2
8
V
3
32 V–VDD
–40
125
C
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TPS28226
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