TPA3131D2_15 Datasheet, PDF (5/35 Pages) Texas Instruments – TPA313xD2 4-W, 25-W Filter-Free Class-D Stereo Amplifier With AM Avoidance

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage, V_CC
PV_CC, AV_CC
INPL, INNL, INPR, INNR
Input voltage, V_I
PLIMIT, GAIN / SLV, SYNC
AM0, AM1, AM2, MUTE, SDZ
Slew rate, maximum
AM0, AM1, AM2, MUTE, SDZ
Operating free-air temperature, T_A
Operating junction temperature, T_J
Storage temperature, T_stg
TPA3131D2, TPA3132D2
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
MIN
MAX
UNIT
–0.3
30
V
–0.3
6.3
V
–0.3 GVDD+0.3
V
–0.3 PVCC+0.3
V
10
V/ms
–40
85
°C
–40
150
°C
–40
125
°C
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage
V_IH
High-level input
voltage
V_IL
Low-level input
voltage
V_OL
Low-level output
voltage
I_IH
High-level input
current
R_L(BTL) _{Minimum load}
R_L(PBTL) ^Impedance
L_o
Output-filter
Inductance
PV_CC, AV_CC
AM0, AM1, AM2, MUTE, SDZ, SYNC
AM0, AM1, AM2, MUTE, SDZ, SYNC
FAULTZ, R_PULL-UP = 100 kΩ, PV_CC = 26 V
AM0, AM1, AM2, MUTE, SDZ (V_I = 2 V, V_CC = 18 V)
Output filter: L = 10 µH, C = 680 nF
Output filter: L = 10 µH, C = 1 µF
Minimum output filter inductance under short-circuit condition
MIN NOM MAX UNIT
4.5
26 V
2
V
0.8 V
0.8 V
50 µA
3.2
4
Ω
1.6
1
µH
6.4 Thermal Information
R_θJA
ψ_JT
ψ_JB
THERMAL METRIC⁽¹⁾⁽²⁾
Junction-to-ambient thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
TPA313xD2
VQFN
32 PINS
31.3
0.2
5.5
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high.
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