SN74CBT3384ADGVR Datasheet, PDF (5/12 Pages) Texas Instruments – 10-BIT FET BUS SWITCH

www.ti.com
PACKAGE OPTION ADDENDUM
29-Aug-2005
PACKAGING INFORMATION
Orderable Device
SN74CBT3384ADBLE
SN74CBT3384ADBQR
SN74CBT3384ADBQRE4
SN74CBT3384ADBR
Status ⁽¹⁾
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP
SSOP/
QSOP
SSOP/
QSOP
SSOP
Package
Drawing
DB
DBQ
DBQ
DB
SN74CBT3384ADBRE4
ACTIVE
SSOP
DB
SN74CBT3384ADGVR
ACTIVE TVSOP
DGV
SN74CBT3384ADGVRE4 ACTIVE TVSOP
DGV
SN74CBT3384ADW
ACTIVE
SOIC
DW
SN74CBT3384ADWE4
ACTIVE
SOIC
DW
SN74CBT3384ADWR
ACTIVE
SOIC
DW
SN74CBT3384ADWRE4
ACTIVE
SOIC
DW
SN74CBT3384APW
ACTIVE TSSOP
PW
SN74CBT3384APWE4
ACTIVE TSSOP
PW
SN74CBT3384APWLE OBSOLETE TSSOP
PW
SN74CBT3384APWR
ACTIVE TSSOP
PW
SN74CBT3384APWRE4
ACTIVE TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
24
TBD
Call TI
Call TI
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24
TBD
Call TI
Call TI
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
24 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1