SN74CBT3251 Datasheet, PDF (5/12 Pages) Texas Instruments – 1-OF-8 FET MULTIPLEXER/DEMULTIPLEXER

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PACKAGE OPTION ADDENDUM
30-Aug-2005
PACKAGING INFORMATION
Orderable Device
SN74CBT3251D
SN74CBT3251DBLE
SN74CBT3251DBQR
SN74CBT3251DBQRE4
SN74CBT3251DBR
SN74CBT3251DBRE4
SN74CBT3251DE4
SN74CBT3251DR
SN74CBT3251DRE4
SN74CBT3251PW
SN74CBT3251PWE4
SN74CBT3251PWLE
SN74CBT3251PWR
SN74CBT3251PWRE4
SN74CBT3251RGYR
Status ⁽¹⁾
ACTIVE
Package
Type
SOIC
Package
Drawing
D
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP/
QSOP
SSOP/
QSOP
SSOP
DB
DBQ
DBQ
DB
ACTIVE
SSOP
DB
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
OBSOLETE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
QFN
RGY
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16
TBD
Call TI
Call TI
16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16
TBD
Call TI
Call TI
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1