CD4724B_13 Datasheet, PDF (5/13 Pages) Texas Instruments – CMOS 8-BIT ADDRESSABLE LATCH

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
CD4724BE
CD4724BEE4
CD4724BF3A
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE
PDIP
N
16
25
ACTIVE
PDIP
N
16
25
ACTIVE
CDIP
J
16
1
Eco Plan
(2)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
Lead/Ball Finish
CU NIPDAU
MSL Peak Temp
(3)
N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
A42
N / A for Pkg Type
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
CD4724BPWR
CD4724BPWRE4
CD4724BPWRG4
NRND
NRND
NRND
TSSOP
TSSOP
TSSOP
PW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125
& no Sb/Br)
PW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125
& no Sb/Br)
PW 16 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -55 to 125
& no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
CD4724BE
CD4724BE
CD4724BF3A
CD4724B
CD4724B
CD4724B
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a}
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples