CD4009UB Datasheet, PDF (5/12 Pages) Texas Instruments – CMOS HEX BUFFERS/CONVERTERS

www.ti.com
PACKAGE OPTION ADDENDUM
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
89264UKB3T
CD4009UBE
CD4009UBF
CD4009UBF3A
CD4009UBM
CD4009UBM96
CD4009UBMT
CD4009UBNSR
CD4009UBPW
CD4009UBPWR
CD4010BE
CD4010BF
CD4010BF3A
CD4010BM
CD4010BM96
CD4010BMT
CD4010BNSR
CD4010BPW
CD4010BPWR
Status ⁽¹⁾
OBSOLETE
ACTIVE
Package
Type
CFP
PDIP
Package
Drawing
WR
N
ACTIVE
CDIP
J
ACTIVE
CDIP
J
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SO
NS
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
PDIP
N
ACTIVE
CDIP
J
ACTIVE
CDIP
J
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SO
NS
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16
None
Call TI
Call TI
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16 40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 90
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
16 2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
16 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16
1
None
Call TI
Level-NC-NC-NC
16 40
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
16 90
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
16 2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
Addendum-Page 1