TS3A4741_15 Datasheet, PDF (4/26 Pages) Texas Instruments – TS3A474x 0.9-Ω Low-Voltage Single-Supply 2-Channel SPST Analog Switches

TS3A4741, TS3A4742
SCDS228E – AUGUST 2006 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
V_NO
V_COM
V_IN
I_NO
I_COM
I_CC
I_GND
T_A
T_J
T_stg
Supply voltage reference to GND⁽²⁾
Analog and digital voltage
On-state switch current
Continuous current through V_CC or GND
Peak current pulsed at 1 ms, 10% duty cycle
Operating temperature
Junction temperature
Storage temperature
V_NO, V_COM = 0 to V_CC
COM, V_NO, V_COM
MIN
–0.3
–0.3
–100
–40
–65
MAX
4
V_CC + 0.3
100
±100
±200
85
150
150
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Signals on COM or NO exceeding V_CC or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
V_NO
V_COM
V_IN
Supply voltage reference to ground
Analog voltage
Digital Voltage
MIN MAX UNIT
1.6 3.6 V
0 3.6
0 1.8
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TS3A474x
DCN/DGK
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
214.8
191.0
113.1
52.4
110.2
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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