TRF3701 Datasheet, PDF (4/5 Pages) Texas Instruments – 0.6 GHz to 1.0 GHz QUADRATURE MODULATOR

TRF3701
0.6 GHz to 1.0 GHz
QUADRATURE MODULATOR
SLWS145 – FEBRUARY 2003
RHC (S–PQFP–N16)
MECHANICAL DATA
(CUSTOM PACKAGE)
PLASTIC QUAD FLATPACK
4,15
A
3,85
B
PIN 1 INDEX AREA
TOP AND BOTTOM
161^{ÎÎÎÎ}₂ ^{ÎÎÎÎÎÎÎÎ}
4,15
3,85
1,00
0,80
0,08 C
0,20 NOMINAL
LEAD FRAME
0,05
0,00
SEATING PLANE
C
PIN 1 CHAMBER
1,65 MAX
2
1
16
0,80
5
0,725
16 _0,525
EXPOSED THERMAL DIE PAD
D
1,65 MAX
9
12
16
0,435
0,315
0,10
BOTTOM VIEW
4204353/A 05/02
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No–Lead) Package configuration.
D. The Package thermal performance may be enhanced by bonding the thermal die pad to an external thermal plane. This pad is
electrically and thermally connected to the backside of the die and possibly selected ground leads.
4
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