TPS28225 Datasheet, PDF (4/30 Pages) Texas Instruments – High-Frequency 4-A Sink Synchronous MOSFET Driver

TPS28225
SLUS710 – MAY 2006
www.ti.com
TYPICAL APPLICATIONS (continued)
Multi-Phase Synchronous Buck Converter
V_DD (4.5 V to 8 V)
6 VDD BOOT 2
V_IN (3 V to 32 V − V_DD)
TPS28225
UGATE 1
3 _PWM PHASE ₈
PWM1 2
To Driver
PWM2 1
VIN ₈
To Driver
PWM3 ₈
PWM 4 5
GNDS
7
GND ₄
VOUT
3
7 EN/PG
LGATE ⁵
GND 4
6 VDD BOOT 2
TPS28225
UGATE 1
3 _PWM ^PHASE 8
7 EN/PG
Enable
LGATE ⁵
GND 4
CS 1
To Controller
To Controller
CS 4 CSCN
V_OUT
ORDERING INFORMATION^(1)(2)(3)
TEMPERATURE RANGE, T_A = T_J
-40°C to 125°C
PACKAGE
Plastic 8-pin SOIC (D)
Plastic 8-pin SOIC (D)
Plastic 8-pin DFN (DRB)
Plastic 8-pin DFN (DRB)
TAPE AND REEL QTY.
250
2500
250
3000
PART NUMBER
TPS28225DT
TPS28225DR
TPS28225DRBT
TPS28225DRBR
(1) SOIC-8 (D) and DFN-8 (DRB) packages are available taped and reeled. Add T suffix to device type (e.g. TPS28225DT) to order taped
devices and suffix R to device type to order reeled devices.
(2) The SOIC-8 (D) and DFN-8 (DRB) package uses in Pb-Free lead finish of Pd-Ni-Au which is compatible with MSL level 1 at 255°C to
260°C peak reflow temperature to be compatible with either lead free or Sn/Pb soldering operations.
(3) In the DFN package, the pad underneath the center of the device is a thermal substrate. The PCB “thermal land” design for this
exposed die pad should include thermal vias that drop down and connect to one or more buried copper plane(s). This combination of
vias for vertical heat escape and buried planes for heat spreading allows the DFN to achieve its full thermal potential. This pad should
be either grounded for best noise immunity, and it should not be connected to other nodes.
4
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