TPS2816-EP_09 Datasheet, PDF (4/24 Pages) Texas Instruments – SINGLE-CHANNEL HIGH-SPEED MOSFET DRIVER

TPS2816-EP, TPS2817-EP, TPS2818-EP
TPS2819-EP, TPS2828-EP, TPS2829-EP
SGDS039 – FEBRUARY 2008
www.ti.com
TPS28xxY Chip Information
This chip, when properly assembled, displays characteristics similar to those of the TPS28xx. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(4)
(5)
39
(2)
(3)
(1)
(4)
OUT
(2)
GND
(3)
IN
TPS2816Y
(5)
V_CC
(1)
V_DD†
†_{TPS2816 through TPS2819 only}
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T_J max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
39
TERMINAL
NAME
NO.
V_DD
1
GND
2
IN
3
OUT
4
V_CC
5
TERMINAL
NAME
NO.
V_DD
1
GND
2
IN
3
OUT
4
V_CC
5
TERMINAL FUNCTIONS
TPS2816, TPS2818, TPS2828 (Inverting Driver)
DESCRIPTION
Regulator supply voltage input. (Not connected on TPS2828)
Ground
Driver input.
Driver output, OUT = IN
Driver supply voltage/regulator output voltage
TERMINAL FUNCTIONS
TPS2817, TPS2819, TPS2829 (Noninverting Driver)
DESCRIPTION
Regulator supply voltage input. (Not connected on TPS2829)
Ground
Driver input.
Driver output, OUT = IN
Driver supply voltage/regulator output voltage
4
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Product Folder Link(s): TPS2816-EP TPS2817-EP TPS2818-EP TPS2819-EP TPS2828-EP TPS2829-EP