TPA6133A2_15 Datasheet, PDF (4/26 Pages) Texas Instruments – TPA6133A2 138-mW DirectPath™ Stereo Headphone Amplifier

TPA6133A2
SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014
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7 Specification
7.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range, T_A = 25°C (unless otherwise noted)
MIN
MAX
Supply voltage, V_DD
Input voltage
RIGHTINx, LEFTINx
SD, TEST1, TEST2
–0.3
6
CPVSS-0.2 V to minimum of
(3.6 V, VDD+0.2 V)
–0.3
7
Output continuous total power dissipation
See the Thermal Information Table
Operating free-air temperature range, T_A
Operating junction temperature range, T_J
–40
85
–40
150
UNIT
V
V
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
MIN
–65
–3
–750
MAX
150
3
750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
°C
kV
V
7.3 Recommended Operating Conditions
Supply voltage, V_DD
V_IH
High-level input voltage
TEST1, TEST2, SD
V_IL
Low-level input voltage
SD
Minimum Load Impedance
T_A
Operating free-air temperature
MIN
MAX UNIT
2.5
5.5 V
1.3
V
0.35 V
12.8
Ω
–40
85 °C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
RTJ
20 PINS
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
34.8
32.5
11.6
°C/W
0.4
11.6
3.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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