TPA6130A2_15 Datasheet, PDF (4/39 Pages) Texas Instruments – TPA6130A2 138-mW DIRECTPATH™ Stereo Headphone Amplifier with I2C Volume Control

TPA6130A2
SLOS488F – NOVEMBER 2006 – REVISED MARCH 2015
6 Pin Configuration and Functions
YZH (DSBGA) PACKAGE
A1
CPN
A2
CPP
A3
GND
A4
VDD
B1
B2
B3
B4
HPLEFT CPVSS LEFTINP LEFTINM
C1
VDD
C2
C3
C4
GND RIGHTINP RIGHTINM
D1
D2
D3
D4
HPRIGHT SCL
SDA
SD
Top View
A4
VDD
A3
GND
A2
CPP
A1
CPN
B4
B3
B2
B1
LEFTINM LEFTINP CPVSS HPLEFT
C4
C3
C2
RIGHTINM RIGHTINP GND
C1
VDD
D4
D3
D2
D1
SD
SDA
SCL HPRIGHT
Bottom View
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RTJ (WQFN) PACKAGE
TOP VIEW
20
LEFTINM 1
19 18 17
16
15 CPVSS
LEFTINP 2
GND 3
RIGHTINP 4
14 HPLEFT
13 GND
12 VDD
RIGHTINM 5
11 HPRIGHT
6
7
8
9
10
NAME
V_DD
GND
CPP
CPN
LEFTINM
PIN
DSBGA
NO.
WQFN NO.
A4
20
A3
19
A2
18
A1
17
B4
1
LEFTINP
B3
2
CPVSS
B2
15, 16
HPLEFT
B1
14
RIGHTINM
C4
5
RIGHTINP
C3
4
GND
V_DD
SD
SDA
SCL
HPRIGHT
Thermal pad
C2 3, 9, 10, 13
C1
12
D4
6
D3
7
D2
8
D1
11
N/A
Die Pad
INPUT/
OUTPUT/
POWER
(I/O/P)
P
P
P
P
I
I
P
O
I
I
P
P
I
I/O
I
O
P
Pin Functions
DESCRIPTION
Charge pump voltage supply. V_DD must be connected to the common V_DD voltage supply. Decouple
to GND (pin 19 on the QFN) with its own 1 μF capacitor.
Charge pump ground. GND must be connected to common supply GND. It is recommended that this
pin be decoupled to the V_DD of the charge pump pin (pin 20 on the QFN).
Charge pump flying capacitor positive terminal. Connect one side of the flying capacitor to CPP.
Charge pump flying capacitor negative terminal. Connect one side of the flying capacitor to CPN.
Left channel negative differential input. Impedance must be matched to LEFTINP. Connect the left
input to LEFTINM when using single-ended inputs.
Left channel positive differential input. Impedance must be matched to LEFTINM. AC ground
LEFTINP near signal source while maintaining matched impedance to LEFTINM when using single-
ended inputs.
Negative supply generated by the charge pump. Decouple to pin 19 on the QFN or a GND plane.
Use a 1 μF capacitor.
Headphone left channel output. Connect to left terminal of headphone jack.
Right channel negative differential input. Impedance must be matched to RIGHTINP. Connect the
right input to RIGHTINM when using single-ended inputs.
Right channel positive differential input. Impedance must be matched to RIGHTINM. AC ground
RIGHTINP near signal source while maintaining matched impedance to RIGHTINM when using
single-ended inputs.
Analog ground. Must be connected to common supply GND. It is recommended that this pin be used
to decouple V_DD for analog. Use pin 13 to decouple pin 12 on the QFN package.
Analog V_DD. V_DD must be connected to common V_DD supply. Decouple with its own 1-μF capacitor to
analog ground (pin 13 on the QFN).
Shutdown. Active low logic. 5V tolerant input.
SDA - I²C Data. 5V tolerant input.
SCL - I²C Clock. 5V tolerant input.
Headphone light channel output. Connect to the right terminal of the headphone jack.
Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is
required for mechanical stability and will enhance thermal performance.
4
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