TPA2025D1_15 Datasheet, PDF (4/29 Pages) Texas Instruments – TPA2025D1 2-W Constant Output Power Class-D Audio Amplifier With Class-G Boost Converter and Battery Tracking AGC

TPA2025D1
SLOS717B – AUGUST 2011 – REVISED DECEMBER 2014
8 Specifications
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8.1 Absolute Maximum Ratings
Over operating free–air temperature range, T_A= 25°C (unless otherwise noted)⁽¹⁾
Supply voltage
Input Voltage, V_I
Output continuous total power dissipation
Operating free-air temperature range, T_A
Operating junction temperature range, T_J
Minimum load resistance
Maximum input voltage swing
Storage temperature range, T_stg
VBAT
IN+, IN–
EN = 0 V
MIN
MAX
–0.3
6
–0.3
VBAT + 0.3
See Thermal Information
–40
85
–40
150
3.2
2
–65
150
UNIT
V
V
°C
°C
Ω
V_RMS
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
Machine model (MM)
VALUE
±2000
±500
±100
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
8.3 Recommended Operating Conditions
Supply voltage, VBAT
V_IH High–level input voltage, EN
V_IL
Low–level input voltage, EN
T_A
Operating free-air temperature
T_J
Operating junction temperature
MIN MAX UNIT
2.5
5.2 V
1.3
V
0.6 V
–40
85 °C
–40
150 °C
8.4 Thermal Information
THERMAL METRIC⁽¹⁾
TPA2025D1
YZG
UNITS
12 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
97.3
36.7
55.9
°C/W
13.9
49.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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