TMP107 Datasheet, PDF (4/40 Pages) Texas Instruments – TMP107 Digital Temperature Sensor with Bidirectional UART One-Wire Interface and EEPROM

TMP107
SBOS716B – MAY 2015 – REVISED SEPTEMBER 2015
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V+
Input voltage
Sink current
Temperature
I/O1, I/O2
R1, R2
ALERT1, ALERT2
ALERT1, ALERT2
Operating junction
Storage, T_stg
MIN
MAX
UNIT
6
V
–0.3
(V+) + 0.3
–0.3
6
V
–0.3
6
10
mA
–55
150
°C
–60
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage, V+
Operating free-air temperature, T_A
MIN
NOM
MAX UNIT
1.7
3.3
5.5
V
–55
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TMP107
D (SOIC)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
116.3
62.5
56.6
14.6
56.0
N/A
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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