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TLC274 Datasheet, PDF (4/42 Pages) Texas Instruments – LinCMOSE PRECISION QUAD OPERATIONAL AMPLIFIERS | |||
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TLC274, TLC274A, TLC274B, TLC274Y, TLC279
LinCMOS⢠PRECISION QUAD OPERATIONAL AMPLIFIERS
SLOS092C â SEPTEMBER 1987 â REVISED MARCH 1998
TLC274Y chip information
These chips, when properly assembled, display characteristics similar to the TLC274C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(14)
(13)
(12) (11) (10)
(9)
68
(1)
(2)
(3) (4) (5)
(6)
108
VDD
(8)
(4)
(3)
1IN +
+
(1)
(2)
1OUT
1IN â
â
2OUT
3IN +
3IN â
(7)
(10)
+
(9)
â
+ (5)
(6)
â
(8)
2IN +
2IN â
3OUT
(14)
4OUT
+ (12)
(13)
â
4IN +
4IN â
11
(7)
GND
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 Ã 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
4
⢠POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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