OPA4277-EP Datasheet, PDF (4/20 Pages) Texas Instruments – OPA4277-EP High Precision Operational Amplifier

OPA4277-EP
SBOS714 – NOVEMBER 2014
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) ⁽¹⁾
Supply voltage
Input voltage
Output short circuit
Operating temperature
Junction temperature
Lead temperature (soldering, 10 s)
MIN
MAX
36
(V–) – 0.7 (V+) + 0.7
Continuous
–55
125
150
300
UNIT
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Machine model (MM)
MIN
–55
–2000
–100
MAX
125
2000
100
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
°C
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Dual supply voltage
T_J
Operating junction temperature
MIN
MAX
UNIT
±5
±15
V
–55
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA4277-EP
D (14 PINS)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
66.3
19.3
26.8
°C/W
2.1
26.2
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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