OPA2320-Q1_15 Datasheet, PDF (4/31 Pages) Texas Instruments – Precision, 20-MHz, 0.9-pA, Low-Noise, RRIO,CMOS Operational Amplifier

OPA2320-Q1
SLOS884 – SEPTEMBER 2014
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.⁽¹⁾
Supply voltage
Voltage ⁽²⁾
Current ⁽²⁾
Operating temperature, T_A
Junction temperature, T_J
V+ and V–
Signal input pins
Signal input pins
Output short-circuit current⁽³⁾
MIN
MAX
6
V_(V–) – 0.5
–10
V_(V+) + 0.5
10
Continuous
–40
150
150
UNIT
V
V
mA
mA
°C
°C
(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
6.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Human body model (HBM), per AEC Q100-002⁽¹⁾
Electrostatic discharge
Charged device model (CDM), per
AEC Q100-011
Corner pins (1, 4, 5,
and 8)
Other pins
MIN
–65
–2000
–750
–500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
MAX
150
2000
750
500
UNIT
°C
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Supply voltage
T_A
Ambient operating temperature
MIN
1.8 (±0.9)
–40
NOM
MAX
5.5 (±2.75)
125
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DGK
8 PINS
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
174.8
43.9
95
2
93.5
—
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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