OPA2211-EP Datasheet, PDF (4/32 Pages) Texas Instruments – OPA2211-EP 1.1-nV/√Hz Noise, Low-Power, Precision Operational Amplifier

OPA2211-EP
SBOS761 – NOVEMBER 2015
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Input voltage
V_S = (V+) – (V–)
Input current (any pin except power-supply pins)
Output short-circuit⁽²⁾
Junction temperature, T_J
Storage temperature, T_stg
MIN
MAX
40
(V–) – 0.5
(V+) + 0.5
–10
10
Continuous
150
–65
150
UNIT
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to V_S / 2 (ground in symmetrical dual supply setups), one amplifier per package.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±3000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage (V+ – V–)
4.5 (±2.25)
Operating temperature, T_J
–55
NOM
MAX
36 (±18)
125
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
OPA2211-EP
DRG (WSON)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
47.3
°C/W
51.8
°C/W
21.8
°C/W
0.7
°C/W
21.9
°C/W
4.2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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