OPA209_15 Datasheet, PDF (4/29 Pages) Texas Instruments – 2.2nV/√Hz, Low-Power, 36V, Operational Amplifier

OPA209
OPA2209
OPA4209
SBOS426C – NOVEMBER 2008 – REVISED OCTOBER 2013
www.ti.com
ELECTRICAL CHARACTERISTICS: V_S = ±2.25V to ±18V (continued)
Boldface limits apply over the specified temperature range, T_A = –40°C to +125°C.
At T_A = +25°C, R_L = 10kΩ connected to midsupply, and V_CM = V_OUT = midsupply, unless otherwise noted.
OPA209, OPA2209, OPA4209
PARAMETER
CONDITIONS
MIN
TYP
MAX
OUTPUT
Voltage Output Swing
R_L = 10kΩ, A_OL > 130dB
(V–) + 0.2V
(V+) – 0.2V
R_L = 600Ω, A_OL > 114dB
(V–) + 0.6V
(V+) – 0.6V
over Temperature
Short-Circuit Current
Capacitive Load Drive (stable operation)
Open-Loop Output Impedance
I_SC
C_LOAD
Z_O
R_L = 10kΩ, A_OL > 120dB
V_S = ±18V
(V–) + 0.2V
(V+) – 0.2V
±65
See Typical Characteristics
See Typical Characteristics
POWER SUPPLY
Specified Voltage
V_S
Quiescent Current (per amplifier)
I_Q
over Temperature
I_O = 0A
±2.25
±18
2.2
2.5
3.25
TEMPERATURE RANGE
Specified Range
T_A
–40
+125
Operating Range
T_A
–55
+150
UNIT
V
V
V
mA
V
mA
mA
°C
°C
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
OPA209AID
D
OPA209AIDBV
DBV
OPA209AIDGK
DGK
UNITS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
8
135.5
73.7
61.9
19.7
54.8
n/a
5
204.9
200
113.1
38.2
104.9
n/a
8
142.6
46.9
63.5
5.3
62.8
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
OPA2209AID
D
OPA2209AIDGK OPA4209AIPW
DGK
PW
UNITS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
8
134.3
72.1
60.7
18.2
53.8
n/a
8
132.7
38.5
52.1
2.4
52.8
n/a
14
112.9
26.1
61.0
0.7
59.2
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
4
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