LP3991_15 Datasheet, PDF (4/25 Pages) Texas Instruments – LP3991 300-mA Linear Voltage Regulator for Digital Applications

LP3991
SNVS296I – DECEMBER 2006 – REVISED AUGUST 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)
IN, OUT pins, voltage to GND
EN pin, voltage to GND
Junction temperature
Continuous power dissipation⁽⁴⁾
Storage temperature, T_stg
MIN
MAX
–0.3
6.5
–0.3
(V_IN + 0.3) < 6.5
150
Internally Limited
–65
150
UNIT
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Input voltage
Recommended load current
Junction temperature
Ambient temperature, T_A ⁽¹⁾
MIN NOM MAX
1.65
4
300
–40
125
–40
85
UNIT
V
mA
°C
°C
(1) The maximum ambient temperature (T_A-MAX) is a suggested value dependant on the maximum operating junction temperature (T_J-MAX-
OP) ^{= 125°C); the maximum power dissipation of the device in the application (P}D-MAX^{), and the junction-to-ambient thermal resistance of}
the part / package in the application (R_θJA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LP3991
YZR (DSBGA)
UNIT
4 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance, High K
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
189.7
0.5
112.9
8.7
112.8
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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