LP3871_15 Datasheet, PDF (4/26 Pages) Texas Instruments – LP387x 0.8-A Fast Ultra-Low-Dropout Linear Regulators

LP3871, LP3874
SNVS225H – FEBRUARY 2003 – REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
Input supply voltage (survival)
Shutdown input voltage (survival)
Output voltage (survival)⁽³⁾⁽⁴⁾
I_OUT (survival)
Maximum voltage for ERROR Pin
Maximum voltage for SENSE Pin
Power dissipation⁽⁵⁾
Storage temperature, T_stg
MIN
MAX
−0.3
7.5
−0.3
7.5
−0.3
6
Short-circuit protected
V_IN
V_OUT
Internally Limited
−65
150
UNIT
V
V
V
V
V
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.
(4) The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get
forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically
withstand 200 mA of DC current and 1 A of peak current.
(5) Internal thermal shutdown circuitry protects the device from permanent damage.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Input supply voltage⁽¹⁾
2.5
Shutdown input voltage
−0.3
Maximum operating current (DC)
Junction temperature
−40
(1) The minimum operating value for V_IN is equal to either [V_OUT(NOM) + V_DROPOUT] or 2.5 V, whichever is greater.
MAX
7
7
0.8
125
UNIT
V
V
A
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LP3871, LP3874
NC (SOT-223)
KTT (DDPAK/TO-263)
UNIT
5 PINS
5 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
65.2
40.3
°C/W
47.2
43.4
°C/W
9.9
23.1
°C/W
3.4
11.5
°C/W
9.7
22
°C/W
—
1
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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