LP2992_15 Datasheet, PDF (4/33 Pages) Texas Instruments – LP2992 Micropower 250-mA Low-Noise Ultralow-Dropout Regulator in SOT-23 and WSON Packages Designed for Use with Very Low-ESR Output Capacitors

LP2992
SNVS171H – NOVEMBER 2001 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
Lead temperature (soldering, 5 seconds)
Power dissipation⁽³⁾
Input supply voltage (survival)
Shutdown input voltage (survival)
Output voltage (survival)⁽⁴⁾
I_OUT (survival)
Input-output voltage (survival)⁽⁵⁾
Storage temperature, T_stg
MIN
MAX
260
Internally Limited
−0.3
16
−0.3
16
−0.3
9
Short-Circuit Protected
−0.3
16
−65
150
UNIT
°C
V
V
V
V
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military- or Aerospace-specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability
and specifications.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature, T_J(MAX), the junction-to-ambient thermal
resistance, R_θJA, and the ambient temperature, T_A. The maximum allowable power dissipation at any ambient temperature is calculated
using:
P_(MAX) = (T_J(MAX) – T_A) / R_θJA
Where the value of R_θJA for the SOT-23 package is 174.2°C/W in a typical PC board mounting and the WSON package is 72.3°C/W.
Exceeding the maximum allowable dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.
(4) If used in a dual-supply system where the regulator load is returned to a negative supply, the LP2992 output must be diode-clamped to
ground.
(5) The output PNP structure contains a diode between the IN to OUT pins that is normally reverse-biased. Reversing the polarity from V_IN
to V_OUT will turn on this diode.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_IN
V_ON/OFF
I_OUT
T_J
Input supply voltage
ON/OFF input voltage
Output current
Operating junction temperature
MIN
2.2 ⁽¹⁾
0
–40
MAX
16
V_IN
250
125
(1) Recommended minimum V_IN is the greater of 2.2 V or V_OUT + rated dropout voltage (maximum) for operating load current.
UNIT
V
V
mA
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LP2992
DBV
NGD
UNIT
5 PINS 6 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
174.2
72.3
76.3
81.6
30.9
39.5
°C/W
2.8
2.0
30.4
39.2
n/a
11.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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