LMZ22008_15 Datasheet, PDF (4/36 Pages) Texas Instruments – 8A SIMPLE SWITCHER Power Module With 20-V Maximum Input Voltage and Current Sharing

LMZ22008
SNVS712H – FEBRUARY 2010 – REVISED AUGUST 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)^(1)(2)(3)
MIN
VIN to PGND
–0.3
EN, SYNC to AGND
–0.3
SS, FB, SH to AGND
–0.3
AGND to PGND
–0.3
Junction Temperature
Peak Reflow Case Temperature (30 sec)
Storage Temperature
–65
MAX
24
5.5
2.5
0.3
150
245
150
UNIT
V
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) For soldering specifications, refer to the following document: SNOA549
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾
VALUE
±2000
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-114.
6.3 Recommended Operating Conditions
VIN
EN, SYNC
Operation Junction Temperature
MIN
MAX
UNIT
6
20
V
0
5
V
−40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMZ22008
NDW
UNIT
11 PINS
R_θJA
Junction-to-ambient thermal
resistance ⁽²⁾
Natural Convection
225 LFPM
500 LFPM
9.9
6.8
°C/W
5.2
R_θJC(top) Junction-to-case (top) thermal resistance
1.0
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Theta JA measured on a 3.0” x 3.5” 4-layer board, with 2-oz. copper on outer layers and 1-oz. copper on inner layers, two hundred and
ten thermal vias, and 2-W power dissipation. Refer to evaluation board application note layout diagrams.
4
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