LMR14006_15 Datasheet, PDF (4/24 Pages) Texas Instruments – LMR14006 SIMPLE SWITCHER® 40 V 600 mA Buck Regulator With High Efficiency Sleep Mode

LMR14006
SNVSA10B – NOVEMBER 2013 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
PARAMETER
Input Voltages
V_IN to GND
SHDN to GND
FB to GND
CB to SW
Output Voltages
SW to GND
SW to GND less than 30ns transients
T_J Operation Junction
Temperature
MIN
MAX
UNIT
-0.3
45
-0.3
45
V
-0.3
7
-0.3
7
-1
45
V
-2
45
-40
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 Handling Ratings
MIN
T_stg
Storage temperature range
-55
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins except CB pin⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
MAX
165
1000
500
UNIT
°C
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process, CB pin passes 500V
test.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions ⁽¹⁾
Over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
V_IN
4
CB
4
Buck Regulator
CB to SW
-0.3
SW
-1
FB
0
Control
SHDN
0
Temperature
Operating junction temperature
-40
range, T_J
MAX
40
46
6
40
5.5
40
125
UNIT
V
V
V
V
V
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.4 Thermal Information
THERMAL METRIC ⁽¹⁾
TSOT
(6 PINS)
UNIT
Rθ_JA
Rθ_JCtop
Rθ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to board characterization parameter
102
36.9
°C/W
28.4
(1) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to
JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number
of thermal vias, board size, ambient temperature, and air flow.
4
Submit Documentation Feedback
Product Folder Links: LMR14006
Copyright © 2013–2014, Texas Instruments Incorporated