LMH2110_15 Datasheet, PDF (4/36 Pages) Texas Instruments – LMH2110 8-GHz Logarithmic RMS Power Detector with 45-dB Dynamic Range

LMH2110
SNWS022D – JANUARY 2010 – REVISED JUNE 2015
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
MIN
MAX
Supply voltage
V_BAT – GND
5.5
Input power
12
RF input
DC voltage
1
Enable input voltage
Junction temperature⁽³⁾
GND – 0.4 < V_EN and V_EN< Min (V_DD – 0.4 V, 3.6 V)
150
Maximum lead temperature (Soldering,10 sec)
260
Storage temperature, T_stg
−65
150
UNIT
V
dBm
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation is a function of T_J(MAX), R_θJA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/R_θJA. All numbers apply for packages soldered directly into a PC board.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
Machine Model
VALUE
±2000
±1000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Operating temperature
RF frequency
RF input power
MIN
MAX
UNIT
2.7
5
V
−40
85
°C
50
8000
MHz
−40
5
dBm
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH2110
YFQ (DSBGA)
UNIT
6 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
133.7
1.7
22.6
5.7
22.2
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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