LM3674_15 Datasheet, PDF (4/26 Pages) Texas Instruments – LM3674 2-MHz, 600-mA Step-Down DC-DC Converter in SOT-23

LM3674
SNVS405G – DECEMBER 2005 – REVISED APRIL 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾
V_IN pin: voltage to GND
EN, FB, and SW pins
Continuous power dissipation⁽³⁾
Junction temperature (T_J-MAX)
Maximum lead temperature (soldering, 10 seconds)
Storage temperature, T_stg
MIN
MAX
−0.2
6
GND − 0.2 V_IN + 0.2
Internally Limited
125
260
–65
UNIT
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX), the
maximum power dissipation of the device in the application (P_D-MAX) and the junction-to-ambient thermal resistance of the package
(R_θJA) in the application, as given by the following equation: T_A-MAX = T_J-MAX – (R_θJA × P_D-MAX). See Dissipation Ratings for P_D-MAX
values at different ambient temperatures.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE
±2000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Input voltage⁽²⁾
Recommended load current
Junction temperature, T_J
Ambient temperature,T_A
MIN
MAX
2.7
5.5
0
600
–30
125
–30
85
(1) All voltages are with respect to the potential at the GND pin.
(2) Input voltage range recommended for ideal applications performance for the specified output voltages are given below:
V_IN = 2.7 V to 5.5 V for 1 V ≤ V_OUT < 1.8 V
V_IN = (V_OUT + V_{DROP OUT}) to 5.5 V for 1.8 ≤ V_OUT ≤ 3.3 V, where V_{DROP OUT} = I_LOAD × (R_{DSON (P)} + R_INDUCTOR)
UNIT
V
mA
°C
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
Junction-to-ambient thermal resistance
4-layer board
2-layer board
LM3674
DBV (SOT-23)
5 PINS
130
250
UNIT
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Dissipation Ratings
over operating free-air temperature range (unless otherwise noted)
R_θJA
250°C/W (2-layer board)
T_A ≤ 25°C (POWER RATING)
400 mW
T_A = 60°C (POWER RATING)
260 mW
130°C/W (4-layer board)
770 mW
500 mW
T_A = 85°C (POWER RATING)
160 mW
310 mW
4
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