LM3670_15 Datasheet, PDF (4/25 Pages) Texas Instruments – LM3670 Miniature Step-Down DC-DC Converter for Ultra Low Voltage Circuits

LM3670
SNVS250E – NOVEMBER 2004 – REVISED FEBRUARY 2013
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Absolute Maximum Ratings ⁽¹⁾⁽²⁾
V_IN Pin: Voltage to GND
EN Pin: Voltage to GND
FB, SW Pin:
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Soldering, 10 sec.)
ESD Rating ⁽³⁾
Human Body Model:
VIN, SW, FB, EN, GND
Machine Model:
−0.2V to 6.0V
−0.2V to 6.0V
(GND−0.2V) to (V_IN + 0.2V)
−45°C to +125°C
−45°C to +150°C
260°C
2.0kV
200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings ^{(1) (2)}
Input Voltage Range
2.5V to 5.5V
Recommended Load Current
0A to 350 mA
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range
−40°C to +125°C
−40°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
Thermal Properties
Juntion-to-Ambient Thermal Resistance (θ_JA) ⁽¹⁾
250°C/W
(1) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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