LM3630A Datasheet, PDF (4/45 Pages) Texas Instruments – LM3630A High-Efficiency Dual-String White LED Driver

LM3630A
SNVS974 – APRIL 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS ^{(1) (2)}
IN, HWEN, PWM, SCL, SDA, INTN, SEL to
GND
SW, OVP, ILED1, ILED2 to GND
Continuous Power Dissipation ⁽³⁾
Maximum Junction Temperature
T_(J-MAX)
Storage Temperature Range
Maximum Lead Temperature (Soldering) ⁽⁴⁾
Vapor Phase (60 sec.)
Maximum Lead Temperature (Soldering) ⁽⁴⁾
Infrared (15 sec.)
ESD Rating ⁽⁵⁾
Operating Ratings ^{(1) (2)}
Human Body Model
Charged Device Mod
V_IN
T_A
Thermal Properties
Input Voltage Range
Operating Ambient Temperature Range ⁽⁶⁾
θ_JA
Junction-to-Ambient Thermal Resistance, YFQ12
package ⁽⁷⁾
VALUE
−0.3 to 6.0
−0.3 to 45
Internally Limited
150
−45 to +150
215
220
2
500
UNIT
V
°C
kV
V
2.3 to 5.5
V
−40 to +85
°C
78.1
°C/W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 140°C (typ.) and
disengages at T_J = 125°C (typ.).
(4) For detailed soldering specifications and information, please refer to Texas Instruments Application Note 1112: DSBGA Wafer Level
Chip Scale Package (AN-1112)
(5) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7) .
(6) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125ºC), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
(7) Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to Texas
Instruments Application Note 1112: DSBGA Wafer Level Chip Scale Package.
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