LM3444MM Datasheet, PDF (4/30 Pages) Texas Instruments – AC-DC Offline LED Driver

LM3444
SNVS682C – NOVEMBER 2010 – REVISED MAY 2013
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ELECTRICAL CHARACTERISTICS
Limits in standard type face are for T_J = 25°C and those with boldface type apply over the full Operating Temperature
Range ( T_J = −40°C to +125°C). Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at T_J = 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: V_CC = 12V.
Symbol Parameter
Conditions
Min Typ Max Units
V_CC SUPPLY
I_VCC
V_CC-UVLO
Operating supply current
Rising threshold
Falling threshold
1.58 2.25 mA
7.4 7.7
V
6.0 6.4
Hysterisis
1
COFF
V_COFF
Time out threshold
1.22 1.276 1.327 V
5
R_COFF
Off timer sinking impedance
t_COFF
Restart timer
CURRENT LIMIT
33
60
Ω
180
µs
V_ISNS
ISNS limit threshold
1.17 1.269 1.364 V
4
t_ISNS
Leading edge blanking time
Current limit reset delay
125
ns
180
µs
ISNS limit to GATE delay
ISNS = 0 to 1.75V step
33
ns
CURRENT SENSE COMPARATOR
V_FILTER
FILTER open circuit voltage
R_FILTER
FILTER impedance
V_OS
Current sense comparator offset voltage
GATE DRIVE OUTPUT
720 750 780 mV
1.12
MΩ
-4.0 0.1 4.0 mV
V_DRVH
V_DRVL
I_DRV
GATE high saturation
GATE low saturation
Peak souce current
Peak sink current
t_DV
Rise time
Fall time
THERMAL SHUTDOWN
T_SD
Thermal shutdown temperature
Thermal shutdown hysteresis
I_GATE = 50 mA
I_GATE = 100 mA
GATE = V_CC/2
GATE = V_CC/2
C_load = 1 nF
C_load = 1 nF
See ⁽¹⁾
0.24 0.50 V
0.22 0.50
-0.77
A
0.88
15
ns
15
165
°C
20
THERMAL SPECIFICATION
R_θJA
R_θJC
VSSOP junction to ambient
VSSOP junction to case
124
°C/W
76
(1) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design. In applications where high power dissipation
and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient
temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP = 125°C), the maximum power dissipation
of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the part/package in the application (R_θJA), as
given by the following equation: T_A-MAX = T_J-MAX-OP – (R_θJA × P_D-MAX).
4
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