LM2735_15 Datasheet, PDF (4/59 Pages) Texas Instruments – LM2735-xx 520-kHz and 1.6-MHz Space-Efficient Boost and SEPIC DC-DC Regulator

LM2735, LM2735-Q1
SNVS485G – JUNE 2007 – REVISED AUGUST 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
V_IN
SW Voltage
FB Voltage
EN Voltage
Junction Temperature⁽²⁾
Soldering Information, Infrared/Convection Reflow (15 s)
Storage Temperature
MIN
MAX
UNIT
–0.5
7
V
–0.5
26.5
V
–0.5
3
V
–0.5
7
V
150
°C
220
°C
–65
150
°C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device.
6.2 ESD Ratings: LM2735
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾
Charged device model (CDM), per JEDEC specification JESD22-
C101 ⁽³⁾
VALUE
±2000
±1000
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible if necessary precautions are taken.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible if necessary precautions are taken.
6.3 ESD Ratings: LM2735-Q1
V_(ESD)
Human body model (HBM), per AEC Q100-002⁽¹⁾
Electrostatic discharge
Charged device model (CDM), per AEC Q100-011
VALUE
±2000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_IN
V_SW
V_EN ⁽¹⁾
Junction Temperature Range
Power Dissipation
(Internal) SOT-23
(1) Do not allow this pin to float or be greater than V_IN + 0.3 V.
MIN
NOM
MAX UNIT
2.7
5.5
V
3
24
V
0
V_IN
V
–40
125
°C
400
mW
6.5 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case (top) thermal resistance⁽²⁾
Junction-to-board thermal resistance
LM2735, LM2735-Q1
NGG (WSON) DBV (SOT-23)
6 PINS
54.9
50.9
29.3
5 PINS
164.2
115.3
27
LM2735
DGN (MSOP-
PowerPAD)
8 PINS
59
51.2
35.8
UNIT
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) Applies for packages soldered directly onto a 3” × 3” PC board with 2-oz. copper on 4 layers in still air.
4
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