HD3SS3412 Datasheet, PDF (4/18 Pages) Texas Instruments – 4-Channel High-Performance Differential Switch

HD3SS3412
SLAS828A – FEBRUARY 2012 – REVISED FEBRUARY 2012
TYPICAL APPLICATION
Microprocessor _{Port A}
x2
Port B
x2
Port C
x2
Chipset
Memory/GPU
Hub
iGPU
x16
Chipset
I/O Hub
GPIO
SEL Pins
Port B
x2
Port C
x2
x8
Port B
x2
Port C
x2
Port B
x2
Port C
x2
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ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Over operating free-air temperature range (unless otherwise noted)
Supply voltage range (V_DD)
Voltage range
Electrostatic discharge
Absolute minimum/maximum supply voltage range
Differential I/O
Control pin (SEL)
Human body model⁽³⁾
Charged-device model⁽⁴⁾
VALUE
MIN
MAX
–0.5
4
–0.5
4
–0.5
VDD+0.5
±4,000
±1,500
UNIT
V
V
V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC/ESDA JS-001-2011
(4) Tested in accordance with JEDEC JESD22 C101-E
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
Junction-to-ambient thermal resistance
θ_JCtop
Junction-to-case (top) thermal resistance
θ_JCbot
Junction-to-case (bottom) thermal resistance
θ_JB
Junction-to-board thermal resistance
ψ_JT
Junction-to-top characterization parameter
ψ_JB
Junction-to-board characterization parameter
Device Power Dissipation (P_D)
HD3SS3412
42-PIN TQFN (RUA)
53.8
38.2
21.9
27.4
5.6
27.3
15.5 (Typ)
21.6 (Max)
UNITS
°C/W
mW
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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