DRV5013-Q1_15 Datasheet, PDF (4/27 Pages) Texas Instruments – DRV5013-Q1 Automotive Digital-Latch Hall Effect Sensor

DRV5013-Q1
SLIS162 – DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Power supply voltage
Output terminal voltage
Output terminal reverse current during
reverse supply condition
Operating junction temperature, T_J
T_stg
V_CC
Voltage ramp rate (V_CC), V_CC < 5 V
Voltage ramp rate (V_CC), V_CC > 5 V
OUT
OUT
Q, see Figure 22
E, see Figure 22
Storage temperature range
MIN
–22 ⁽²⁾
MAX
40
Unlimited
0
2
–0.5
40
0
100
–40
150 ⁽³⁾
–40
175 ⁽⁴⁾
–65
150
UNIT
V
V/µs
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Ensured by design. Only tested to –20 V.
(3) Tested in production to T_A = 125°C.
(4) Tested in production to T_A = 150°C.
7.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE
±2500
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
V_O
I_SINK
T_A
Power supply voltage
Output terminal voltage (OUT)
Output terminal current sink (OUT)⁽¹⁾
Operating ambient
temperature
Q, see Figure 22
E, see Figure 22
(1) Power dissipation and thermal limits must be observed
MIN
MAX UNIT
2.7
38
V
0
38
V
0
30 mA
–40
125
°C
–40
150
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV5013-Q1
DBZ
LPG
UNIT
(3 PINS)
(3 PINS)
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
333.2
99.9
66.9
4.9
65.2
180
98.6
154.9
40
154.9
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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