CD54HC4511 Datasheet, PDF (4/17 Pages) Texas Instruments – BCD-TO-7 SEGMENT LATCH/DECODER/DRIVERS

CD54HC4511, CD74HC4511, CD74HCT4511
BCDĆTOĆ7 SEGMENT LATCH/DECODER/DRIVERS
SCHS279D − DECEMBER 1998 − REVISED OCTOBER 2003
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage range, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input diode current, I_IK (V_I < −0.5 V or V_I > V_CC + 0.5 V) ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output diode current, I_OK (V_O < −0.5 V or V_O > V_CC + 0.5V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output source or sink current per output, I_O (V_O = 0 to V_CC) . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through V_CC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θ_JA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Lead temperature (during soldering):
At distance 1/16 ± 1/32 in (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . 265°C
Unit inserted into a PC board (minimum thickness 1/16 in, 1.59 mm),
with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65 to 150°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions for ’HC4511 (see Note 3)
TA = 25°C
MIN MAX
TA = −55°C
TO 125°C
MIN MAX
TA = −40°C
TO 85°C
MIN MAX
UNIT
VCC Supply voltage
2
6
2
6
2
6V
VCC = 2 V
1.5
1.5
1.5
VIH High-level input voltage
VCC = 4.5 V
3.15
3.15
3.15
V
VCC = 6 V
4.2
4.2
4.2
VCC = 2 V
0.5
0.5
0.5
VIL
Low-level input voltage
VCC = 4.5 V
1.35
1.35
1.35 V
VCC = 6 V
1.8
1.8
1.8
VI
Input voltage
0 VCC
0 VCC
0 VCC V
VO
Output voltage
0 VCC
0 VCC
0 VCC V
VCC = 2 V
1000
1000
1000
tt
Input transition (rise and fall) time
VCC = 4.5 V
500
500
500 ns
VCC = 6 V
400
400
400
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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