CC2541F256RHAR Datasheet, PDF (4/30 Pages) Texas Instruments – 2.4-GHz Bluetooth™ low energy and Proprietary System-on-Chip

CC2541
SWRS110D – JANUARY 2012 – REVISED JUNE 2013
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ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Voltage on any digital pin
Input RF level
Storage temperature range
ESD ⁽²⁾
All supply pins must have the same voltage
All pins, excluding pins 25 and 26, according to human-body
model, JEDEC STD 22, method A114
All pins, according to human-body model, JEDEC STD 22,
method A114
According to charged-device model, JEDEC STD 22, method
C101
MIN
MAX
UNIT
–0.3
3.9
V
–0.3 VDD + 0.3 ≤ 3.9
V
10
dBm
–40
125
°C
2
kV
1
kV
500
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sesnsitive device. Precautions should be used when handling the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
Operating ambient temperature range, T_A
Operating supply voltage
MIN NOM MAX
–40
85
2
3.6
UNIT
°C
V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2541 EM reference design with T_A = 25°C and VDD = 3 V,
1 Mbps, GFSK, 250-kHz deviation, Bluetooth low energy mode, and 0.1% BER
PARAMETER
TEST CONDITIONS
RX mode, standard mode, no peripherals active, low MCU
activity
RX mode, high-gain mode, no peripherals active, low MCU
activity
TX mode, –20 dBm output power, no peripherals active, low
MCU activity
TX mode, 0 dBm output power, no peripherals active, low
MCU activity
I_core Core current consumption
Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and
sleep timer active; RAM and register retention
Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep
timer active; RAM and register retention
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
Low MCU activity: 32-MHz XOSC running. No radio or
peripherals. Limited flash access, no RAM access.
Timer 1. Timer running, 32-MHz XOSC used
Timer 2. Timer running, 32-MHz XOSC used
Peripheral current consumption
Timer 3. Timer running, 32-MHz XOSC used
I_peri
(Adds to core current I_core for each
peripheral unit activated)
Timer 4. Timer running, 32-MHz XOSC used
Sleep timer, including 32.753-kHz RCOSC
ADC, when converting
MIN TYP MAX UNIT
17.9
20.2
mA
16.8
18.2
270
1
µA
0.5
6.7
mA
90
90
60
μA
70
0.6
1.2
mA
4
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