TAS5414A Datasheet, PDF (39/44 Pages) Texas Instruments – FOUR-CHANNEL AUTOMOTIVE DIGITAL AMPLIFIERS

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PACKAGE OPTION ADDENDUM
5-Oct-2007
PACKAGING INFORMATION
Orderable Device
TAS5414ATDKDMQ1
TAS5414ATDKDMQ1G4
TAS5414ATDKDQ1
TAS5414ATDKDQ1G4
TAS5414ATDKDRMQ1
TAS5414ATDKDRMQ1G4
TAS5414ATDKDRQ1
TAS5414ATDKDRQ1G4
TAS5424ATDKDMQ1
TAS5424ATDKDMQ1G4
TAS5424ATDKDQ1
TAS5424ATDKDQ1G4
TAS5424ATDKDRMQ1
TAS5424ATDKDRMQ1G4
TAS5424ATDKDRQ1
TAS5424ATDKDRQ1G4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SSOP
Package
Drawing
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
SSOP
DKD
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
36 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
36 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 29 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
44 500 Green (RoHS & CU NIPDAU Level-3-245C-168 HR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1