DAC5311_08 Datasheet, PDF (36/41 Pages) Texas Instruments – 1.8V to 5.5V, 80mA, 8-, 10-, and 12-Bit, Low-Power, Single-Channel, DIGITAL-TO-ANALOG CONVERTERS in SC70 Package

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PACKAGE OPTION ADDENDUM
13-Nov-2008
PACKAGING INFORMATION
Orderable Device
DAC5311IDCKR
DAC5311IDCKRG4
DAC5311IDCKT
DAC5311IDCKTG4
DAC6311IDCKR
DAC6311IDCKRG4
DAC6311IDCKT
DAC6311IDCKTG4
DAC7311IDCKR
DAC7311IDCKRG4
DAC7311IDCKT
DAC7311IDCKTG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SC70
Package
Drawing
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1