THS7001 Datasheet, PDF (31/32 Pages) Texas Instruments – 70-MHz PROGRAMMABLE-GAIN AMPLIFIERS

PWP (R-PDSO-G**)
20-PIN SHOWN
0,65
20
1
A
THS7001, THS7002
70-MHz PROGRAMMABLE-GAIN AMPLIFIERS
SLOS214B – OCTOBER 1998 – REVISED AUGUST 1999
MECHANICAL DATA
PowerPAD™ PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,19
11
0,10 M
Thermal Pad
(See Note C)
4,50 6,60
4,30 6,20
0,15 NOM
Gage Plane
10
0°– 8°
0,25
0,75
0,50
1,20 MAX
Seating Plane
0,15
0,10
0,05
PINS **
14
16
20
24
28
DIM
A MAX
5,10
5,10
6,60
7,90
9,80
A MIN
4,90
4,90
6,40
7,70
9,60
4073225/E 03/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This solderable pad
is electrically and thermally connected to the backside of the die and possibly selected leads. The maximum pad size on the printed
circult board should be equal to the package body size – 2,0 mm.
PowerPAD is a trademark of Texas Instruments Incorporated.
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