TLC227X-Q1 Datasheet, PDF (30/35 Pages) Texas Instruments – ADVANCED LINCMOS RAIL-TO -RAIL OPERATIONAL AMPLIFIERS

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PACKAGE OPTION ADDENDUM
22-Apr-2008
PACKAGING INFORMATION
Orderable Device
TLC2272AQDRG4Q1
TLC2272AQDRQ1
TLC2272AQPWRG4Q1
TLC2272AQPWRQ1
TLC2272QDRG4Q1
TLC2272QDRQ1
TLC2272QPWRG4Q1
TLC2272QPWRQ1
TLC2274AQDRG4Q1
TLC2274AQDRQ1
TLC2274AQPWRG4Q1
TLC2274AQPWRQ1
TLC2274QDRG4Q1
TLC2274QDRQ1
TLC2274QPWRG4Q1
TLC2274QPWRQ1
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
Package
Drawing
D
SOIC
D
TSSOP
PW
TSSOP
PW
SOIC
D
SOIC
D
TSSOP
PW
TSSOP
PW
SOIC
D
SOIC
D
TSSOP
PW
TSSOP
PW
SOIC
D
SOIC
D
TSSOP
PW
TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2000
TBD
CU NIPDAU Level-1-250C-UNLIM
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500
TBD
CU NIPDAU Level-1-220C-UNLIM
8 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2000
TBD
CU NIPDAU Level-1-250C-UNLIM
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000
TBD
CU NIPDAU Level-1-250C-UNLIM
14 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14 2000
TBD
CU NIPDAU Level-1-250C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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