UA741MU Datasheet, PDF (3/23 Pages) Texas Instruments – GENERAL-PURPOSE OPERATIONAL AMPLIFIERS

µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
µA741Y chip information
This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
(8)
VCC+
IN + ⁽³⁾ ₊
(2)
IN –
–
(7)
(6)
OUT
OFFSET N1 ⁽¹⁾
(4)
OFFSET N2 ⁽⁵⁾
VCC _–
45
(5)
(1)
(2)
36
(4)
(3)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C.
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
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