TPA6130A2 Datasheet, PDF (3/26 Pages) Texas Instruments – 138-mW DIRECTPATH STEREO HEADPHONE AMPLIFIER WITH I2C VOLUME CONTROL

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TPA6130A2
SLOS488A – NOVEMBER 2006 – REVISED DECEMBER 2006
A1
CPN
A2
CPP
A3
GND
A4
VDD
B1
B2
B3
B4
HPLEFT CPVSS LEFTINP LEFTINM
C1
VDD
C2
C3
C4
GND RIGHTINP RIGHTINM
D1
D2
D3
D4
HPRIGHT SCL
SDA
SD
Top (Symbol Side) View WCSP Package (YZH)
A4
VDD
A3
GND
A2
CPP
A1
CPN
20
LEFTINM 1
19 18 17
16
15 CPVSS
B4
B3
B2
B1
LEFTINP 2
LEFTINM LEFTINP CPVSS HPLEFT
GND 3
C4
C3
C2
C1
RIGHTINP 4
RIGHTINM RIGHTINP GND
VDD
RIGHTINM 5
D4
D3
D2
D1
6
SD
SDA
SCL HPRIGHT
14 HPLEFT
T op View
13 GND
12 VDD
11 HPRIGHT
7
8
9
10
Bottom (Ball Side) View WCSP Package (YZH)
Top View QFN Package (RTJ)
NAME
V_DD
TERMINAL
BALL
WCSP
PIN QFN
A4
20
GND
A3
19
CPP
A2
18
CPN
A1
17
LEFTINM
B4
1
LEFTINP
B3
2
CPVSS
B2
HPLEFT
B1
RIGHTINM C4
15, 16
14
5
RIGHTINP
C3
4
GND
V_DD
SD
SDA
SCL
HPRIGHT
Thermal
pad
C2
3, 9, 10,
13
C1
12
D4
6
D3
7
D2
8
D1
11
N/A Die Pad
TERMINAL FUNCTIONS
INPUT/
OUTPUT/
POWER
(I/O/P)
P
P
P
P
I
I
P
O
I
I
P
P
I
I/O
I
O
P
DESCRIPTION
Charge pump voltage supply. V_DD must be connected to the common V_DD voltage
supply. Decouple to GND (pin 19 on the QFN) with its own 1 µF capacitor.
Charge pump ground. GND must be connected to common supply GND. It is
recommended that this pin be decoupled to the V_DD of the charge pump pin (pin 20 on
the QFN).
Charge pump flying capacitor positive terminal. Connect one side of the flying capacitor
to CPP.
Charge pump flying capacitor negative terminal. Connect one side of the flying capacitor
to CPN.
Left channel negative differential input. Impedance must be matched to LEFTINP.
Connect the left input to LEFTINM when using single-ended inputs.
Left channel positive differential input. Impedance must be matched to LEFTINM. AC
ground LEFTINP near signal source while maintaining matched impedance to LEFTINM
when using single-ended inputs.
Negative supply generated by the charge pump. Decouple to pin 19 on the QFN or a
GND plane. Use a 1 µF capacitor.
Headphone left channel output. Connect to left terminal of headphone jack.
Right channel negative differential input. Impedance must be matched to RIGHTINP.
Connect the right input to RIGHTINM when using single-ended inputs.
Right channel positive differential input. Impedance must be matched to RIGHTINM. AC
ground RIGHTINP near signal source while maintaining matched impedance to
RIGHTINM when using single-ended inputs.
Analog ground. Must be connected to common supply GND. It is recommended that this
pin be used to decouple V_DD for analog. Use pin 13 to decouple pin 12 on the QFN
package.
Analog V_DD. V_DD must be connected to common V_DD supply. Decouple with its own
1-µF capacitor to analog ground (pin 13 on the QFN).
Shutdown. Active low logic. 5V tolerant input.
SDA - I²C Data. 5V tolerant input.
SCL - I²C Clock. 5V tolerant input.
Headphone light channel output. Connect to the right terminal of the headphone jack.
Solder the thermal pad on the bottom of the QFN package to the GND plane of the
PCB. It is required for mechanical stability and will enhance thermal performance.
3