TLE2227 Datasheet, PDF (3/31 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION DUAL OPERATIONAL AMPLIFIERS

TLE2227, TLE2227Y, TLE2237, TLE2237Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS184 – FEBRUARY 1997
TLE2237Y chip information
ThIs chip, when properly assembled, displays characteristics similar to TLE2237. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(8)
116
(1)
(6)
(2)
(3)
104
(5)
VCC ₊
(8)
1IN + ⁽³⁾ ₊
(1)
(2)
1OUT
1IN –
–
(7)
2OUT
+
(5)
2IN +
(6)
–
2IN –
(4)
(4)
VCC _–
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
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