TLE2142 Datasheet, PDF (3/29 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION DUAL OPERATIONAL AMPLIFIERS

symbol (each amplifier)
TLE2142, TLE2142A, TLE2142Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION DUAL OPERATIONAL AMPLIFIERS
SLOS064B – DECEMBER 1990 – REVISED AUGUST 1994
IN +
+
IN –
–
OUT
TLE2142Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2142. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(2)
(1)
(8)
VCC+
(8)
(7)
(3)
IN +
+
(1)
(2)
OUT
IN –
–
(7)
OUT
(5)
+
IN +
(6)
–
IN –
(4)
VCC _–
90
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
(3)
(6)
TJmax = 150°C
TOLERANCES ARE ± 10%.
(4)
(5)
80
ALL DIMENSIONS ARE IN MILS.
PIN 4 IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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