TLE2141 Datasheet, PDF (3/29 Pages) Texas Instruments – EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS

symbol
OFFSET N1
IN +
IN –
OFFSET N2
TLE2141, TLE2141A, TLE2141Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS062D – NOVEMBER 1990 – REVISED AUGUST 1994
+
OUT
–
TLE2141Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2141. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
64
(1)
(2)
(6)
(1) ^VCC+
OFFSET N1
(7)
(3)
IN +
+
(6)
(2)
OUT
IN –
–
(5)
(5)
(4)
OFFSET N2
VCC _–
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
(4)
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
(3)
65
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