TLC272BCDR Datasheet, PDF (3/51 Pages) Texas Instruments – LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS

TLC272, TLC272A, TLC272B, TLC272Y, TLC277
LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS
equivalent schematic (each amplifier)
VDD
SLOS091E – OCTOBER 1987 – REVISED FEBRUARY 2002
P3
P4
R6
R1
IN –
P1
IN +
R2
N5
P2
R5
C1
P5 P6
OUT
N1
N2
R3
D1 R4
N3
N4
D2
N6
N7
R7
GND
TLC272Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC272C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
60
73
(3)
1IN +
(2)
1IN –
(7)
2OUT
VDD
(8)
+
–
+
–
(4)
GND
(1)
1OUT
(5)
2IN +
(6)
2IN –
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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