TLC2652 Datasheet, PDF (3/31 Pages) Texas Instruments – Advanced LinCMOSE PRECISION CHOPPER-STABILIZED OPERATIONAL AMPLIFIERS

TLC2652, TLC2652A, TLC2652Y
Advanced LinCMOS™ PRECISION CHOPPER-STABILIZED
OPERATIONAL AMPLIFIERS
SLOS019C – SEPTEMBER 1988 – REVISED FEBRUARY 1999
TLC2652Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC2652C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(13)
(12)
(11)
(14)
80
(1)
(10)
(9)
(8)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (7) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
FOR THE PINOUT, SEE THE FUNCTIONAL
BLOCK DIAGRAM.
(2)
(4)
(5)
(7)
90
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